• Advanced Etching & Stripping for CMOS

    Plasma etching and stripping for FEOL (STI, Finfet, spacer, metal gate,...)
    Plasma etching and stripping for MEOL (contact, self aligned contact)
    Plasma etching and stripping for BEOL application (ULK trenches and vias)


    Etching and Stripping for more than Moore applications

    Plasma etching and stripping for MEMS, bio MEMS, imagers, photonics
    Plasma etching and stripping for 3D IC


    New Processes/New materials

    Patterning with alternative lithography (di-block copolymer, EUV resist…)
    Plasma etching and stripping for III-V materials (HEMT, CMOS, ...)
    Plasma etching and stripping for memories (MRAM, OXRAM, PCRAM, CBRAM...)
    New etch concept (Atomic Layer Etching, Self-limiting etching)
    Plasma for alternative technologies (biotechnology, PV….)


    Plasma fundamentals

    New Plasma Sources
    Advanced plasma diagnostics
    Plasma surface interactions
    Plasma Modeling

  • For further information

    Registration Organization
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    Contact : Nicolas Posseme
    Tel : +33 438 781 002
    Email : nicolas.posseme@cea.fr

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